Account for 44% of global consumer demand, China mainland factory re into crystalline circle

The two ministries finalised clean energy given! Expand the clean energy by the end of the province to cancel inter-provincial trade restrictions, '

at present, China's economy into the structure transition stage, the concrete does not bring the development of independent industry dominance, zte iron core, make Chinese people can not help but sigh, so big country, incredibly even all people in the use of chips are made out. Compared with neighboring South Korea, our in 30 years behind the semiconductor industry, research and development of South Korea's heavily hit in the 80 s, get out of the memory chips, economic recovery over the past two years, the memory chip prices doubled up, south koreans earned billions dollars profit from us, Intel and qualcomm, broadcom, them. Every year, we imported chip value $200 billion, and the size is the same as the imported oil, imports this year of $200 billion, is a disgrace to China's modernization, is our & other; Reinforced concrete & throughout; Extensive development of the bitter.

fortunately, the government and industry already determined to change the status quo. Two big fund has been set up, the domestic semiconductor industry is coruscate gives never have vitality. A big innovation in the field of semiconductor business, is a challenge and opportunity.

according to the China semiconductor industry association statistics, in 2018 China's integrated circuit design, manufacturing and testing industry has achieved rapid growth. The industry total sales income of 6531. 400 million yuan, rose 20. 69%. With manufacturing sales income 1818. 200 million yuan, rose 25. 56%, the proportion of the total output value of China's integrated circuit industry in semiconductor manufacturing industry has already reached 27. 84%.

in the early 1860 s, semiconductor companies are using IDM model, which covers the design, manufacture, assembly and test all of the chip production process.

as technology constantly upgrade and improve the overall cost of the construction of the production line, the semiconductor industry started toward vertical division of labor pattern. Is the semiconductor companies are no longer cover all of the chip manufacturing, gradually separate the focus on semiconductor manufacturing company of each part.

from the core of the entire semiconductor industry chain. One of wafer manufacturing occupy about 51% of the overall sales in the industry of income, its added value is far more than the other two links.

fabs is engaged in the sand materials ( Quartz) Into & other; Chip & throughout; The point of gold. In order to chip design companies, the first thing you need to the wafer to made, secondly also need according to the requirements of design drawings, through photolithography and so on a series of operations to make it into the chip. The overall production time is long, complicated process, the production process can't receive any error. So as long as in the integrated circuit production place small earthquake is very big to the influence that the whole production line.

chip designer is similar to building designers, the circuit design to construction workers to house. While building a house need foundation, production is also a need for wafer chips, used to put all electronic components of the substrate is the wafer ( 晶片) 。

wafer production can imagine forces training, the sand in the cruel polysilicon through a series of strict training, and finally get high purity of 99. 9999% of the single crystal silicon. Specific methods are as follows:

after get high purity of monocrystalline silicon wafer plant will use cutting tools, will be cut into pieces of thin crystal column, like a thin ham slices, again after polishing, becomes a wafer ( 晶片) , that is, the substrate of the chip. 8 inches (

200毫米) And 12 inches ( 300毫米) Is the corresponding high purity silicon wafer diameter after slices. But look from the area size, more than 12 inches 8 inch can use area is big, efficiency is almost 2. About five times. But in the production of larger wafers, the difficulty of manufacturing is a positive correlation with the size of the wafer.

upon completion of the wafer manufacturing, also need to be the key to the next round of manufacturing. Above the blue wafer part structures, circuit structure, it is like to build a house on the foundation, through the metal, coating, coating photoresist etching technology and light resistance to remove layers such as set up.

the technology stack together, have some difficulty in understanding. Before you actually have seen a popular explanation is better, is equivalent to you with spray paint, covering different shaped cardboard on the wafer, the spraying layer on the wafer, set up layer upon layer of the circuit. Then in the process of spraying, through various methods, eliminate redundant paint, the last part needed, left end cutting chip.